Active device array substrate with particular test circuit

ABSTRACT

An active device array substrate is provided. The active device array substrate includes an active matrix device, first bonding pads electrically connected to the active matrix device, second bonding pads electrically insulated from the first bonding pads, test bonding pads disposed between the first and the second bonding pads and separated from the second bonding pads, switch devices disposed between the test bonding pads and the first bonding pads and electrically connected to the test bonding pads, a test signal pad, a switch device control pad, and at least one driving chip electrically connected to the first bonding pads, the second bonding pads, and the test bonding pads. Each test bonding pad is corresponding to one of the second bonding pads. Both the test signal pad for inputting/outputting a test signal and the switch device control pad for turning on/off the switch devices are electrically connected to the switch devices.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan applicationserial no. 98110002, filed on Mar. 26, 2009. The entirety of theabove-mentioned patent application is hereby incorporated by referenceherein and made a part of specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to an active device arraysubstrate, and more particularly, to an active device array substratewith a test circuit.

2. Description of Related Art

Various displays have been quickly developed along with the advancementof photoelectronic and semiconductor technologies. Liquid crystaldisplay (LCD) has been broadly applied and is about to replace theconventional cathode ray tube (CRT) as the mainstream among thenext-generation displays.

In order to improve the yield of active device array substrate in LCD,an electrical test is usually carried out to devices or circuits on anactive device array substrate right after the active device arraysubstrate is fabricated to determine whether these devices or circuitswork properly. In order to test the bonding state between a driving chipand bonding pads on an active device array substrate, a microscope isusually used to observe the bonding state between the driving chip andthe bonding pads. However, such a technique is very time-consuming andmay produce human errors. Thereby, a design of disposing a circuit withan electrical test function in a peripheral circuit area of an activedevice array substrate is provided.

FIG. 1 is a partial top view of a conventional active device arraysubstrate. Referring to FIG. 1, the active device array substrate 100includes an active matrix device 110 disposed in the display area I′ anda plurality of first bonding pads 120 a, 120 b, 120 c, . . . , aplurality of second bonding pads 130 a, 130 b, 130 c, . . . , a testsignal pad 160, and a driving chip (not shown) disposed in theperipheral circuit area II′. The first bonding pads 120 a, 120 b, 120 c,. . . are electrically connected to the active matrix device 110, andthe first bonding pads 120 a, 120 b, 120 c, . . . and the second bondingpads 130 a, 130 b, 130 c, . . . are electrically connected to thedriving chip.

As described above, the first bonding pad 120 a at the left side of FIG.1 is electrically connected to the test signal pad 160. Thus, when thefirst bonding pads 120 a, 120 b, 120 c, . . . and the second bondingpads 130 a, 130 b, 130 c, . . . are bonded with the driving chip, theelectrical property between the first bonding pad 120 a and the drivingchip can be understood through a test signal on the test signal pad 160,so that the bonding state between the first bonding pad 120 a and thedriving chip can be determined. However, the test signal pad 160 canonly test the bonding state between the first bonding pad 120 a and thedriving chip while the bonding states between the first bonding pads 120b, 120 c, . . . and the driving chip cannot be determined.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to an active device arraysubstrate with a inspection circuit, wherein the inspection circuit cantest the bonding states between a plurality of bonding pads and adriving chip electrically connected to the bonding pads.

The present invention provides an active device array substrate having adisplay area and an adjacent peripheral circuit area. The active devicearray substrate includes an active matrix device, a plurality of firstbonding pads, a plurality of second bonding pads, a plurality of testbonding pads, a plurality of switch devices, a test signal pad, a switchdevice control pad, and at least one driving chip. The active matrixdevice is disposed in the display area, and the first bonding pads andthe second bonding pads are disposed in the peripheral circuit area,wherein the first bonding pads are electrically connected to the activematrix device, and the second bonding pads are electrically insulatedfrom the first bonding pads. The test bonding pads are disposed in theperipheral circuit area between the second bonding pads and the firstbonding pads, and are separated from the second bonding pads. Each ofthe test bonding pads is corresponding to one of the second bondingpads. The switch devices are disposed in the peripheral circuit areabetween the test bonding pads and the first bonding pads, and areelectrically connected to test bonding pads. The test signal pad and theswitch device control pad are disposed in the peripheral circuit area,and are electrically connected to the switch devices. The test signalpad inputs or outputs a test signal, and the switch device control padturns on or off the switch devices. The driving chip is electricallyconnected to the first bonding pads, the second bonding pads, and thetest bonding pads.

According to an embodiment of the present invention, the driving chipincludes a plurality of first pins and a plurality of second pins. Thefirst pins are electrically connected to the first bonding pads, and thesecond pins are electrically connected to the second bonding pads andthe test bonding pads. According to an embodiment, each of the secondpins includes a driving portion and a test portion, wherein the drivingportion is electrically connected to the corresponding second bondingpad, and the test portion is electrically connected to the correspondingtest bonding pad. According to an embodiment, in each of the secondpins, the driving portion and the test portion are electricallyconnected to each other. According to another embodiment, in each of thesecond pins, the driving portion and the test portion are separated fromeach other.

According to an embodiment of the present invention, the active devicearray substrate further includes an anisotropic conductive medium,wherein the anisotropic conductive medium is disposed between the firstbonding pads, the second bonding pads, and the test bonding pads and thedriving chip.

According to an embodiment of the present invention, the active devicearray substrate further includes a flexible printed circuit board, aplurality of flexible printed circuit bonding pads, and a plurality oflead wires. The flexible printed circuit bonding pads are disposed inthe peripheral circuit area, and are electrically connected to theflexible printed circuit board. The lead wires are electricallyconnected between the corresponding flexible printed circuit bondingpads and the corresponding second bonding pads respectively.

According to an embodiment of the present invention, each of the switchdevices is a thin film transistor (TFT). According to an embodiment,each of the TFTs has one end electrically connected to test bondingpads, another end electrically connected to test signal pad, and yetanother end electrically connected to switch device control pad.

As described above, the present invention provides an active devicearray substrate with a inspection circuit, wherein the inspectioncircuit has a plurality of test bonding pads. The bonding states betweenbonding pads and a driving chip can be tested through the correspondingtest bonding pads, so that the electrical relationships and bondingstates between the bonding pads and the driving chip can be determined.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention.

FIG. 1 is a partial top view of a conventional active device arraysubstrate.

FIG. 2 is a partial top view of an active device array substrateaccording to an embodiment of the present invention.

FIG. 3 is a cross-sectional view of the active device array substrate inFIG. 2 along line A-B and line C-D.

FIG. 4 is a partial top view of another active device array substrateaccording to another embodiment of the present invention.

DESCRIPTION OF THE EMBODIMENTS

Reference will now be made in detail to the present preferredembodiments of the invention, examples of which are illustrated in theaccompanying drawings. Wherever possible, the same reference numbers areused in the drawings and the description to refer to the same or likeparts.

FIG. 2 is a partial top view of an active device array substrateaccording to an embodiment of the present invention, and FIG. 3 is across-sectional view of the active device array substrate in FIG. 2along line A-B and line C-D, wherein the structure corresponding to thearea AB in FIG. 3 is the cross section of the active device arraysubstrate along the line A-B in FIG. 2, and the structure correspondingto area CD in FIG. 3 is the cross section of the active device arraysubstrate along the line C-D in FIG. 2.

Referring to both FIG. 2 and FIG. 3, in the present embodiment, theactive device array substrate 200 has a display area I and an adjacentperipheral circuit area II, and the active device array substrate 200includes an active matrix device 310 disposed in the display area I anda plurality of first bonding pads 320 a, 320 b, 320 c, . . . , aplurality of second bonding pads 330 a, 330 b, 330 c, . . . , aplurality of test bonding pads 340 a, 340 b, 340 c, . . . , a pluralityof switch devices 350 a, 350 b, 350 c, . . . , a test signal pad 360,and a switch device control pad 370, and at least one driving chip 380disposed in the peripheral circuit area II.

For the convenience of description, following embodiments will bedescribed by taking only one driving chip 380 as an example. However,the number of the driving chip is not limited in the present invention,and in real applications, the number of the driving chip 380 can bedetermined according to the actual requirement.

In the present embodiment, the active device array substrate 200 may bea glass substrate having a chip or chips thereon, wherein the activematrix device 310 may be composed of a plurality of pixel units (notshown) with active devices (not shown), and the driving chip 380 may bea gate driving chip or a source driving chip for driving the pixel unitsin the active matrix device 310.

Besides, in the present embodiment, the driving chip 380 may be bondedto the first bonding pads 320 a, 320 b, 320 c, . . . , the secondbonding pads 330 a, 330 b, 330 c, . . . , and the test bonding pads 340a, 340 b, 340 c, . . . through a chip on glass (COG) process. Thefollowing, the active matrix device 310, the first bonding pads 320 a,320 b, 320 c, . . . , the second bonding pads 330 a, 330 b, 330 c, . . ., and the driving chip 380 in the present embodiment are firstdescribed.

In the present embodiment, the driving chip 380 is electricallyconnected to the first bonding pads 320 a, 320 b, 320 c, . . . and thesecond bonding pads 330 a, 330 b, 330 c, . . . , wherein the firstbonding pads 320 a, 320 b, 320 c, . . . are electrically connected tothe active matrix device 310 but are electrically insulated from thesecond bonding pads 330 a, 330 b, 330 c, . . . . Practically, thedriving chip 380 is electrically connected to the first bonding pads 320a, 320 b, 320 c, . . . and the second bonding pads 330 a, 330 b, 330 c,. . . through a plurality of pins (described below) thereof, andprovides a driving signal to the active matrix device 310 through thefirst bonding pads 320 a, 320 b, 320 c, . . . and the second bondingpads 330 a, 330 b, 330 c, . . . .

For example, the driving chip 380 includes a plurality of first pins anda plurality of second pins, and only one first pin 420 a and one secondpin 430 a are illustrated in FIG. 3 as examples. In the presentembodiment, the first pins (for example, the first pin 420 a) areelectrically connected to the first bonding pads (for example, the firstbonding pad 320 a), and the second pins (for example, the second pin 430a) are electrically connected to the second bonding pads (for example,the second bonding pad 330 a) so that the active matrix device 310 canreceive a driving signal through the driving chip 380.

In the present embodiment, the electrical connection between the firstpins (for example, the first pin 420 a) and the first bonding pads (forexample, the first bonding pad 320 a) and the electrical connectionbetween the second pins (for example, the second pin 430 a) and thesecond bonding pads (for example, the second bonding pad 330 a) areimplemented with an anisotropic conductive medium 500. The anisotropicconductive medium 500 is an anisotropic conductive material, such as ananisotropic conductive film (ACF) or an anisotropic conductive paste(ACP).

To be more specific, the anisotropic conductive medium 500 is disposedbetween the first bonding pads (for example, the first bonding pad 320a) and the first pins (for example, the first pin 420 a) and between thesecond bonding pads (for example, the second bonding pad 330 a) and thesecond pins (for example, the second pin 430 a). Generally, theanisotropic conductive medium 500 is composed of conductive particles.By pressing the first bonding pads (for example, the first bonding pad320 a) and the first pins (for example, the first pin 420 a) togetherand the second bonding pads (for example, the second bonding pad 330 a)and the second pins (for example, the second pin 430 a) together, ashort circuit is formed between the bonding pads (for example, the firstbonding pad 320 a and the second bonding pad 330 a), the conductiveparticles, and the pins (for example, the first pin 420 a and the secondpin 430 a) so that the bonding pads (for example, the first bonding pad320 a and the second bonding pad 330 a) and the pins (for example, thefirst pin 420 a and the second pin 430 a) are electrically connected toeach other.

The disposition relationship among the anisotropic conductive medium500, the other pads and the corresponding pins can be obtained based onforegoing descriptions therefore will not be described herein. In short,the anisotropic conductive medium 500 is disposed between the firstbonding pads 320 a, 320 b, 320 c, and the driving chip 380 and betweenthe second bonding pads 330 a, 330 b, 330 c, and the driving chip 380 sothat the first bonding pads 320 a, 320 b, 320 c, . . . and the secondbonding pads 330 a, 330 b, 330 c, . . . can be electrically connected tothe driving chip 380 through the anisotropic conductive medium 500.

On the other hand, referring to both FIG. 2 and FIG. 3, in the presentembodiment, the active device array substrate 200 may further include aflexible printed circuit (FPC) board 610, a plurality of flexibleprinted circuit bonding pads 620 a, 620 b, 620 c, . . . , and aplurality of lead wires 630 a, 630 b, 630 c, . . . , wherein theflexible printed circuit board 610 is electrically connected to theflexible printed circuit bonding pads 620 a, 620 b, 620 c, . . .disposed in the peripheral circuit area II, and the lead wires 630 a,630 b, 630 c, . . . are electrically connected between the correspondingflexible printed circuit bonding pads 620 a, 620 b, 620 c, . . . and thecorresponding second bonding pads 330 a, 330 b, 330 c, . . .respectively.

To be specific, the lead wire 630 a is electrically connected betweenthe flexible printed circuit bonding pad 620 a and the second bondingpad 330 a, the lead wire 630 b is electrically connected between theflexible printed circuit bonding pad 620 b and the second bonding pad330 b, the lead wire 630 c is electrically connected between theflexible printed circuit bonding pad 620 c and the second bonding pad330 c, and so on.

Accordingly, in the present embodiment, a signal output by the flexibleprinted circuit board 610 can be transmitted to the second bonding pad330 a through the flexible printed circuit bonding pad 620 a and thelead wire 630 a and to the second pin 430 a of the driving chip 380through the anisotropic conductive medium 500. After receiving thissignal, the driving chip 380 generates a driving signal for the activematrix device 310. Then, the driving signal is transmitted to the activematrix device 310 through the first pin 420 a, the anisotropicconductive medium 500, and the first bonding pad 320 a.

How the active matrix device 310 and the driving chip 380 in the displayarea I are connected to each other through the first bonding pads 320 a,320 b, 320 c, . . . and the second bonding pads 330 a, 330 b, 330 c, . .. in the peripheral circuit area II and how the active matrix device 310obtains the driving signal provided by the driving chip 380 can beunderstood based on foregoing descriptions. However, if there is a badelectrical relationship between the driving chip 380 and the secondbonding pads 330 a, 330 b, 330 c, . . . , the driving signal required bythe active matrix device 310, and accordingly the display quality of thedisplay device, may be affected.

In order to fully understand the electrical relationship between thedriving chip 380 and the second bonding pads 330 a, 330 b, 330 c, . . ., in the present embodiment, the test bonding pads 340 a, 340 b, 340 c,. . . , the switch devices 350 a, 350 b, 350 c, . . . , the test signalpad 360, and the switch device control pad 370 are disposed in theperipheral circuit area II. The relationship between the test bondingpads 340 a, 340 b, 340 c, . . . , the switch devices 350 a, 350 b, 350c, . . . , the test signal pad 360, and the switch device control pad370 will be described in following embodiment.

In the present embodiment, the test bonding pads 340 a, 340 b, 340 c, .. . respectively corresponding to the second bonding pads 330 a, 330 b,330 c, . . . are disposed in the peripheral circuit area II between thesecond bonding pads 330 a, 330 b, 330 c, . . . and the first bondingpads 320 a, 320 b, 320 c, . . . , and are separated from the firstbonding pads 320 a, 320 b, 320 c, . . . and the second bonding pads 330a, 330 b, 330 c, . . . . In addition, the switch devices 350 a, 350 b,350 c, . . . are disposed between the test bonding pads 340 a, 340 b,340 c, . . . and the first bonding pads 320 a, 320 b, 320 c, . . . .

In the present embodiment, the switch devices 350 a, 350 b, 350 c, . . .are thin film transistors (TFTs), for example, wherein the three ends ofeach TFT are electrically connected to the test bonding pads 340 a, 340b, 340 c, . . . , the test signal pad 360, and the switch device controlpad 370 respectively. To be specific, one end of the source/drain of aTFT is electrically connected to the test bonding pads 340 a, 340 b, 340c, . . . , and the other one end of the source/drain of the TFT iselectrically connected to the test signal pad 360, and the gate of theTFT is electrically connected to the switch device control pad 370.

Accordingly, in the present embodiment, a test signal can be transmittedinto the test bonding pads 340 a, 340 b, 340 c, . . . through the testsignal pad 360. To be more specific, the switch device control pad 370and the test signal pad 360 respectively provide a turn-on signal and atest signal to the switch devices 350 a, 350 b, 350 c, . . . so that thetest bonding pads 340 a, 340 b, 340 c, . . . electrically connected tothe switch devices 350 a, 350 b, 350 c, . . . can receive the testsignal. Namely, in the present embodiment, the switch devices 350 a, 350b, 350 c, . . . are served as bridges between the test signal pad 360and the test bonding pads 340 a, 340 b, 340 c, . . . for transmitting atest signal, wherein the on/off state of the switch devices 350 a, 350b, 350 c, . . . is controlled by a control signal on the switch devicecontrol pad 370.

For example, referring to both FIG. 2 and FIG. 3, the switch devices 350a, 350 b, 350 c, . . . receive a turn-on signal (for example, ahigh-level signal) through the switch device control pad 370 andaccordingly are turned on. Then, the test bonding pads 340 a, 340 b, 340c, . . . receive the test signal from the test signal pad 360 throughthe switch devices 350 a, 350 b, 350 c, . . . .

As shown in FIG. 2, in the present embodiment, an anisotropic conductivemedium 500 is further disposed between the test bonding pads 340 a, 340b, 340 c, . . . and the driving chip 380. Accordingly, each of the testbonding pads (for example, the test bonding pad 340 a) is electricallyconnected to the corresponding second pin (for example, the second pin430 a). Each of the second pins (for example, the second pin 430 a) isdivided into a driving portion DA and a test portion TA, wherein thedriving portion DA is electrically connected to the corresponding secondbonding pad (for example, the second bonding pad 330 a), and the testportion TA is electrically connected to the corresponding test bondingpad (for example, the test bonding pad 340 a).

As described above, after the test bonding pad 340 a receives the testsignal, it transmits the test signal to the second bonding pad 330 athrough the anisotropic conductive medium 500 and the driving chip 380and then to the flexible printed circuit bonding pad 620 a through thelead wire 630 a. The signal transmission between the test bonding pads340 b, 340 c, . . . , the switch devices 350 b, 350 c, . . . , thesecond bonding pads 330 b, 330 c, . . . , and the flexible printedcircuit bonding pads 620 b, 620 c, . . . can be understood based onforegoing description therefore will not be described herein. In short,in the present embodiment, the test signal can be obtained through thesecond bonding pads 330 a, 330 b, 330 c, . . . and the flexible printedcircuit bonding pads 620 a, 620 b, 620 c, . . . connectedcorrespondingly to the test bonding pads 340 a, 340 b, 340 c, . . . ,and accordingly the electrical relationship between the second bondingpads 330 a, 330 b, 330 c, . . . and the driving chip 380 can bedetermined.

It should be noted that the second pin 430 a illustrated in FIG. 3 maybe composed of a driving portion DA and a test portion TA which areformed integrally. Namely, in the present embodiment, the drivingportion DA and the test portion TA are electrically connected to eachother. However, in another embodiment, the driving portion DAelectrically connected to the second bonding pad (for example, thesecond bonding pad 330 a) and the test portion TA electrically connectedto the test bonding pad (for example, the test bonding pad 340 a) mayalso be separated from each other, such as the second pins (for example,the second pin 430 a) illustrated in FIG. 4.

In addition, in another embodiment, when the switch devices 350 a, 350b, 350 c, . . . are turned on, the test signal may also be input intothe flexible printed circuit bonding pads 620 a, 620 b, 620 c, . . . ,so that the test signal can be transmitted to the test signal pad 360after sequentially passing through the lead wires 630 a, 630 b, 630 c, .. . , the second bonding pads 330 a, 330 b, 330 c, . . . , the drivingchip 380, the test bonding pads 340 a, 340 b, 340 c, . . . , and theswitch devices 350 a, 350 b, 350 c, . . . . Accordingly, the electricalrelationship and bonding state between the second bonding pads 330 a,330 b, 330 c, . . . and the driving chip 380 can also be obtained bydetecting the test signal output by the test signal pad 360.

As described above, the electrical relationship, and accordingly thebonding state, between the second bonding pads 330 a, 330 b, 330 c, . .. and the driving chip 380 can be understood by turning on the switchdevices 350 a, 350 b, 350 c, . . . and supplying the test signal. Fromthe viewpoint of the product, the yield of the active device arraysubstrate 200 and accordingly the display quality of a display devicewhich adopts the active device array substrate 200 can be improved. Fromthe viewpoint of the process, when there is a bad connection between thesecond bonding pads 330 a, 330 b, 330 c, . . . , and the driving chip380, the bad bonding area can be detected instantly so that the badactive device array substrate 200 won't affect subsequent processes andunnecessary working time and cost can be avoided.

Contrarily, if the conventional inspection circuit is adopted, anadditional microscope has to be used for observing the bonding statebetween the bonding pads and the driving chip, and very limitedinformation is obtained from such testing process. While in the presentembodiment, the bonding pads electrically connected to the driving chipcan be also correspondingly connected to a plurality of test bondingpads, and the bonding state between each bonding pad and the drivingchip can be determined through a test signal. Accordingly, the laborcost for using the microscope can be omitted and human error can beavoided. As a result, the reliability of the test is improved.

It should be mentioned that when the switch devices 350 a, 350 b, 350 c,. . . are turned off, the test bonding pads 340 a, 340 b, 340 c, . . .and the test signal pad 360 are electrically insulated from the drivingchip 380 and the second bonding pads 330 a, 330 b, 330 c, . . . . Inother words, after performing the test by using the test bonding pads340 a, 340 b, 340 c, . . . , the switch devices 350 a, 350 b, 350 c, . .. , the test signal pad 360, and the switch device control pad 370, noadditional step is taken in the present embodiment to break or destroythe circuit layout of the test bonding pads 340 a, 340 b, 340 c, . . . ,the switch devices 350 a, 350 b, 350 c, . . . , the test signal pad 360,or the switch device control pad 370, so that no unnecessary step istaken in the process and both the duration and cost of the process canbe reduced.

As described above, in an active device array substrate provided by thepresent invention, the electrical connection and bonding state between adriving chip and a plurality of bonding pads disposed on the activedevice array substrate can be tested. By disposing a plurality of testbonding pads on the active device array substrate, the electricalrelationship, and accordingly the bonding state, between the drivingchip and the bonding pads can be determined. Thereby, the yield andreliability of the active device array substrate are improved, thefabrication process thereof is simplified, and both the duration andcost of the process are reduced.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentinvention without departing from the scope or spirit of the invention.In view of the foregoing, it is intended that the present inventioncover modifications and variations of this invention provided they fallwithin the scope of the following claims and their equivalents.

1. An active device array substrate, having a display area and an adjacent peripheral circuit area, the active device array substrate comprising: an active matrix device, disposed in the display area; a plurality of first bonding pads, disposed in the peripheral circuit area and electrically connected to the active matrix device; a plurality of second bonding pads, disposed in the peripheral circuit area and electrically insulated from the first bonding pads; a plurality of test bonding pads, disposed in the peripheral circuit area between the second bonding pads and the first bonding pads, and separated from the second bonding pads, wherein each of the test bonding pads is corresponding to one of the second bonding pads; a plurality of switch devices, disposed in the peripheral circuit area between the test bonding pads and the first bonding pads, and electrically connected to the test bonding pads; a test signal pad, disposed in the peripheral circuit area, and electrically connected to the switch devices, for inputting or outputting a test signal; a switch device control pad, disposed in the peripheral circuit area, and electrically connected to the switch devices, for turning on or off the switch devices; and at least one driving chip, electrically connected to the first bonding pads, the second bonding pads, and the test bonding pads.
 2. The active device array substrate according to claim 1, wherein the driving chip comprises: a plurality of first pins, electrically connected to the first bonding pads; and a plurality of second pins, electrically connected to the second bonding pads and the test bonding pads.
 3. The active device array substrate according to claim 2, wherein each of the second pins comprises: a driving portion, electrically connected to the corresponding second bonding pad; and a test portion, electrically connected to the corresponding test bonding pad.
 4. The active device array substrate according to claim 3, wherein in each of the second pins, the driving portion and the test portion are electrically connected to each other.
 5. The active device array substrate according to claim 3, wherein in each of the second pins, the driving portion and the test portion are separated from each other.
 6. The active device array substrate according to claim 1, further comprising: an anisotropic conductive medium, disposed between the first bonding pads, the second bonding pads, and the test bonding pads and the driving chip.
 7. The active device array substrate according to claim 1, further comprising: a flexible printed circuit board; a plurality of flexible printed circuit bonding pads, disposed in the peripheral circuit area, and electrically connected to the flexible printed circuit board; and a plurality of lead wires, electrically connected between the corresponding flexible printed circuit bonding pads and the corresponding second bonding pads respectively.
 8. The active device array substrate according to claim 1, wherein each of the switch devices is a thin film transistor (TFT).
 9. The active device array substrate according to claim 8, wherein each of the TFTs has one end electrically connected to the test bonding pads, another end electrically connected to the test signal pad, and yet another end electrically connected to the switch device control pad. 